pcimeur03appigbt| Application Note

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pcimeur03appigbt| Application Note


A New Flexible Low-Cost IGBT Inverter Power Module for Appliance Applications
Mario Battello, Neeraj Keskar, Peter Wood, Mor Hezi, Alberto Guerra International Rectifier Appliance Group, El Segundo CA As presented at PCIM Europe 2003
Abstract- Power modules for inverterized motor drive applications are a current trend due to the advantages they present like space saving and ease of assembly. However, their widespread use is limited due to cost issues and relative design inflexibility. A novel low-cost intelligent power module (IPM) series has been developed for appliance applications, which addresses these factors. Characteristics of the new intelligent power module enable lower overall power losses compared to current competing technology. Significant improvement in the EMI performance of the system has been obtained despite faster dynamic switching through use of special packaging techniques. These traits are clearly demonstrated by performing in-depth evaluations in an actual home air conditioning application.

I. INTRODUCTION The electronics industry is in a "high-density mounting" period in which progress is being made at phenomenal rates. In order to obtain high power density, the IR PlugNDrive power modules represent a sophisticated, integrated solution. It enables the integration of 3 phase motor drives used in a variety of appliances, such as washing machines, energy efficient refrigerators and air conditioning compressor drives up to 3KW. The modules utilize non-punch-through (NPT), IGBT technology matched with hyperfast diode. In addition to the IGBT power switches, the modules contain a 6output monolithic gate driver ICs, matched to the drive requirements of the IGBTs to generate the most efficient power switch consistent with minimum noise generation and maximum ruggedness. All these components are mounted on Insulated Metal Substrate (IMS). Insulated Metal Substrate Technology (IMST), which originally was developed as a low cost method for mounting bare chips, has evolved into an excellent technology for
achieving high performance and high reliability in high-density solutions. The IMST substrate uses an aluminum plate as the base. The upper side of the substrate forms a sandwich of a high voltage dielectric and a copper cladding on which the circuit is etched, similar to a conventional printed wiring board. This allows the creation of hybrid ICs that take advantage of two primary features of the aluminum substrate, namely high thermal conductivity and simple machining.

II. SYSTEM DESCRIPTION The 600V PlugNDrive module contains six IGBT dies each with its own discrete gate resistor, six commutation diode dies, one three-phase monolithic, level shifting driver chip, three bootstrap diodes with a current limiting resistor and an NTC thermistor/resistor pair for over-temperature protection. The over current trip circuit also responds to an input signal generated from an external sense element such as a current transformer or sense resistor. The input pin for the T/Itrip circuit performs a dual function as an input pin for over current trip voltage and an output pin for the module analog temperature sensing thermistor. The module schematic shows the thermistor and its associated components to facilitate the design of external circuitry. A small resistor (R3) is included in the bootstrap circuit to limit peak currents in the bootstrap diodes especially when using large value bootstrap capacitors, which are necessary under certain operating conditions. The power module integrates
the IC driver and the power stages into an isolated module but the `brains' of the system must generate timing, speed and direction PWM or PFM information to complete the motor drive function. 5volt logic systems are generally preferred from a noise immunity standpoint but the module can also accept 3.3V logic or any signal level up to Vcc (+15V). The monolithic driver IC inputs have pull-up resistors to the internal 5V reference and require a logic low to command an output. The pull-down current is 300uA maximum. The T/Itrip input is 4.3V nominal and the under voltage lockout voltage is 11V. Further information on the PlugNDrive family characteristics is available at www.irf.com. III. SWITCHING PERFORMANCE AND ENERGY LOSSES The non-punch through (NPT) IGBTs and hyperfast diodes used in the IR PlugNDrive power modules are designed for fast switching without excessive ringing. Competing modules built on punch-through (PT) technology were also evaluated in the application and their performance compared with t
he IR power module.


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