AN1891| Application Note
Maxim/Dallas > App Notes > GENERAL ENGINEERING TOPICS WIRELESS, RF, AND CABLE
PROTOTYPING AND PC BOARD LAYOUT
Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP
Feb 18, 2003
APPLICATION NOTE 1891
UCSP - A Wafer-Level Chip-Scale Package
A complete discussion introducing Maxim's UCSPTM chip-scale package is offered, including details on construction, tape and reel packaging, PCB layout, assembly and reflow, as well as reliability.
Introduction
The Wafer-Level Chip-Scale Package (WLCSP) is a type of CSP which enables the integrated circuit (IC) to be attached to the printed-circuit board face-down, with the chip's pads connecting to the PC board's pads through individual solder balls without needing any underfill material (Figure 1). This technology differs from other ballgrid array, leaded, and laminate based CSP's because there are no bond wires or interposer connections. The principle advantage of the WLCSP is that the IC-to-PC board inductance is minimized. Secondary benefits are reduction in package size and manufacturing cycle time and enhanced thermal conduction characteristics. Maxim's WLCSP is trademarked as UCSP.
Figure 1. Photo of a 4x4 UCSP, bottom side view.
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