AN-1364| Application Note
TO-247 Package
TO-247 Package
National Semiconductor Application Note 1364 February 2005
Table of Contents
Introduction ................................................................................................................................................... Package Mounting Guide ............................................................................................................................. External Heatsink and PCB Leads Alignment Guidelines ............................................................................ Package Lead Bend ..................................................................................................................................... Package Marketing Outline Drawing ............................................................................................................ 2 2 4 5 5
AN-1364
Microfil is a trademark of National Semiconductor Corporation.
2005 National Semiconductor Corporation
AN201393
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